Current Evolution of Wafer Thinning and Dicing

Abstract

Over the past few years the backend assembly process has become increasingly complex in order to add more value to products. Two processes that are linked to the changes in assembly are wafer thinning and dicing. Ultra thin stacked die and the implementation of TSVs are driving improvements to the traditional stress relief and fixed abrasive grinding processes. Both CMP (Chemo-Mechanical Polishing) and MCP (Mechano-Chemical Polishing) are being used. Wafer dicing has a number of products and processes behind its evolution. Thin and stacked die with DAF (Die Attach Film) require modifications to existing blade dicing processes. Low-k and copper wafers are requiring the use of lasers to remove materials from the dicing streets. A new and alternative laser dicing process called Stealth Dicing is an enabling technology for a number of products.