Abstract
To enhance the thermal stability of metal-semiconductor nanowire(NW)-metal (M-S-M) nanostructure under high electrical and thermal stress conditions, current-induced failure of ZnSe NWs in the M-S-M nanostructure is studied by in situ transmission electron microscopy. When the single NW is replaced by a bundle of NWs, the large current density flowing through the single NW protruding out of the bundle of NWs is responsible for the electrical breakdown of NWs. In this case, the failure mechanism of the NW changes from the bias polarity-dependent mode to the current density-dependent mode. Consequently, a decrease of current density at the reversely biased metal-semiconductor (M-S) nanocontacts can significantly improve the thermal stability of ZnSe NWs in the M-S-M nanostructure and can enhance the performance of the semiconductor NW-based nanoelectronics.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
