Abstract

A dynamic torsional vibration method has been developed and used to investigate the isothermal cure processes of a thermosetting resin containing fillers. The isothermal cure behaviour of an epoxy resin-imidazole-SiO2 system at various temperatures and various SiO2 filler loadings was predicted using non-equilibrium thermodynamic fluctuation theory. There was good agreement between the theoretical prediction and experimental curing curves. It has been shown that activation energy of the cure reaction remained almost a constant value of ΔH=76.6×103 J mol−1 within the range 0 to 120 phr SiO2 filler loadings, but SiO2 filler has a complicated effect on the rate of the cure reaction.

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