Abstract
ABSTRACT In this study, an SiO2/epoxy adhesive that can be cured in a wet/water environment was prepared. Nonisothermal differential scanning calorimetry was used to evaluate the curing reaction of this adhesive. Kinetic parameters of the adhesive were obtained using the Kissinger, Ozawa, Flynn–Wall–Ozawa, and Kissinger–Akahira–Sunose methods. The results show that the isoconversional methods can well explain the curing behavior of SiO2/epoxy adhesive. Further, the tensile lap-shear strength of the prepared adhesive cured in air and water increased by 35.96% and 32.07% than pure epoxy adhesive, respectively. Although the presence of water molecules affects the bond strength of the SiO2/epoxy adhesive, its bond strength underwater was only 1.45 MPa lower than that in air. Compared to the pure epoxy resin, the tensile and flexural strength of SiO2/epoxy adhesive cured in air were 12.23%, 6.67% higher and those of the adhesive cured in water were 10.24% and 6.62% higher, respectively. Compared to the pure epoxy resin, the tensile and flexural modulus of SiO2/epoxy adhesive cured in air increased by 13.71%, 10.25% and those of the adhesive cured in water increased by 11.21% and 10.41%, respectively.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
