Abstract
The curing behaviour of a new epoxy curing agent, 2, 6-di (p-aminophenyl) benzo[1.2.5.4] bisoxazole (DIABO) was discussed. Diglycidyl-4, 5-epoxycyclohexane -1,2-dicarboxylate (TDE) was cured with a mixture of DIABO and diaminodiphenylsulfone (DDS). The aspects investigated including the curing procedure, reaction kinetics parameters and the heat resistance of the product. Average apparent activation energy of the resin's curing reaction was 63.55 kJ/mol, calculated according to the Kissinger and the Ozawa methods. The glass transition temperature was 261 °C and 257 °C determined by torsional braid analysis (TBA) and differential scanning calorimetry (DSC) respectively. The integral procedural decomposition temperature (IPDT) was 814 °C, respectively. Char residue was 44.58% at 572 °C. Compared to cure with TDE/DDS, these properties were improved by 18%, 8%, 30% and 50%, respectively.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
