Curing behavior of epoxy resin having hydroxymethyl group

Abstract

AbstractA new type of epoxy resin having hydroxymethyl group was synthesized. This epoxy resin was mixed with commercial epoxy resin in various ratios. The mixed epoxy resins were cured with a mixture of 4,4′‐diaminodiphenylmethane and m‐phenylenediamine (molar ratio, 6 : 4) as a hardener. Curing behavior of the epoxy resin systems with the hardener was examined by DSC and TG‐DSC, and parameters of cure reaction were obtained. Viscoelastic properties of cured resin were studied by dynamic mechanical analyzer.It was found that the higher the amount of epoxy resin having hydroxymethyl group, the lower the activation energy (Ea) and the higher the rate constant (k) were. It was also found that the higher the amount of the epoxy resin having hydroxymethyl group, the better heat resistance the fully‐cured resin had.These results were explained as follows: Hydroxymethyl group accelerated an epoxideamine reaction. The crosslinking density of the cured resin was increased because in the hydroxymethyl group occurred a condensation reaction above 200°C.