Abstract
AbstractThe curing behavior of a novel low temperature curing polytriazole resin, prepared from p‐xylylene diazide and N,N,N′,N′‐tetrapropargyl‐p,p′‐diaminodiphenylmethane, was investigated by DSC and rheological analyses. The kinetics of the curing of the resin was studied by nonisothermal and isothermal DSC measurements and the kinetics parameters were obtained. The values of apparent activation energy Ea of the curing reaction obtained by nonisothermal and isothermal DSC are 80.7 and 75.3 kJ/mol, respectively. The curing of the resin was traced by the isothermal rheological analysis. The gelation times of the resin at 70, 75, 80, and 85°C are about 200, 150, 110, and 75 min, respectively. The viscosity equation for the resin was found as follows: $ \ln \eta= -107 + {{33.5 \times 10^3} \over T} + t \exp \left(26.3 + {{9.87 \times 10^3} \over T}\right). $ © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007
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