Abstract
Poly (amide-amidic acid) (PAA) and 4, 4′-diaminodiphenylsulfone (DDS) with varying molar ratios were used as co-curing agents to cure diglycidyl ether of bisphenol-A (DGEBA). The curing process was investigated. The differences between PAA and the conventional curing agents are discussed relative to the curing behavior and mechanism when cured with DGEBA. It was found that a lower temperature was needed to cure DGEBA when PAA was used as co-curing agent with DDS. There was only one step during the curing process of DGEBA and PAA, compared with the conventional curing agents (two steps). The activation energy (E) of the curing process of DGEBA with the co-curing agents, computed using model free estimations, was lower than that with DDS and PAA individually.
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