Abstract
This paper describes the synthesis and characterization of epoxy resins based on (hexafluoroisopropylidene)diphenol (EFN) and p,p’-isopropylidenebisphenol (EBN), respectively and 4, 4’- (hexafluoroisopropylidene)dipthalic-imideamine (IMAM), a curing agent. The synthesized epoxy resins and IMAM curing agent were characterized by Fourier Transform Infrared (FTIR) and 1H Nuclear Magnetic Resonance (NMR) spectroscopy.13C NMR technique was also used to characterize IMAM. Study of curing behavior of EFN and EBN with stoichiometric amount of aromatic 4,4’-diaminodiphenylmethane (DDM), 4,4’-diaminodiphenylsulfone (DDS) and IMAM by using Differential Scanning Calorimetery (DSC) indicated that IMAM was least reactive curing agent towards both epoxy resins as compared to DDS and DDM. The investigation of thermal decomposition of the cured compounds by thermogravimetric analyzer (TGA) indicated the higher thermal stability of EFN and EBN resins initially with DDS and at elevated temperatures with IMAM. It was also observed that EFN resins were thermally more stable than EBN resins cured with corresponding curing agents.
Highlights
Epoxy resins are one of the most important thermosetting epoxy resin
EFN and EBN novolac epoxy resins were synthesized, which were thermally cured with aromatic amines (DDM, DDS) and synthesized aromatic imide-amine (IMAM) curing agents
The investigation of curing behavior of cured epoxy resins revealed that IMAM was found to be the least reactive curing agent towards both EFN and EBN as compared to their counterparts DDM and DDS
Summary
Epoxy resins are one of the most important thermosetting epoxy resin. An attempt has been made to host these resins known to possess good mechanical properties, high fluorinated substituents as well as the aromatic rings on the chemical resistance and excellent adhesive properties. backbone of the curing agent, an Imide-amine, in order to. An attempt has been made to host these resins known to possess good mechanical properties, high fluorinated substituents as well as the aromatic rings on the chemical resistance and excellent adhesive properties. Materials viz for surface coatings, adhesives, corrosion Curing and decomposition behavior of fluorine containing protectants, composites and laminates, encapsulants for epoxy resin (EFN) was compared with bisphenol-A novolac semiconductors, insulating materials for electronic devices based (EBN) epoxy resin by using aromatic DDM, DDS etc[1,2,3,4,5,6,7,8,9,10]. Over the years multifunctional epoxy resins have been synthesized by many researchers to improve
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