Abstract
Bisphenol A epoxy and silicone-epoxy LED encapsulants were cured by using polysilazane cross-linking agents, which could be used to initiate the ring-opening polymerization of epoxy group, and the heat stabilities of the encapsulants were examined. Bisphenol A epoxy encapsulants cured by polysilazane showed better heat stability than that with conventional organic cross-linking agents due to the superior heat stability of silicon-based polysilazane cross-linking agent. Silicone-epoxy encapsulants also presented excellent heat stability owing to the high silicon content of polysilazane cross-linking agent. In order to increase the refractive index of the silicone-epoxy encapsulants, TiO2 nanoparticles were dispersed in the silicone-epoxy and cured by polysilazane. The relationship between the refractive index and the TiO2 content was investigated.
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