Abstract
The curing kinetics of diglycidyl ether of 4,4′-bisphenol (DGEBP) epoxy mesogenic resin in the presence of sulphanilamide (SAA) was studied by non-isothermal differential scanning calorimetry (DSC) at different heating rates. At low heating rates (2–5 °C min −1), the curing reaction takes place by two processes evidenced by the presence of a double peak on the DSC thermograms. The first process is due to the reaction of primary amine with epoxy, while the second one corresponds to the formation of the crosslinked network with liquid crystalline (LC) properties by the attack of the secondary amine previously formed onto the epoxide groups unreacted in the first stage of the reaction. An activation energy ( E a=59 kJ mol −1) was evaluated for the second process and an autocatalytic kinetic model (Šesták–Berggren equation) was proposed to better describe the cure kinetics of the studied system. The theoretical DSC curves calculated using the kinetic parameters determined in non-isothermal conditions show good agreement with those experimentally determined.
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