Abstract
A novel one component thermal curable epoxy adhesive composed of all liquid reactive ingredients was developed recently. Its thermal cure behavior was measured and analyzed with differential scanning calorimetry isothermal method. Workability and pot life at room temperature as well as storage stability and shelf life under chilled, frozen conditions were measured and analyzed by monitoring its viscosity change during the storage period. The measurement results confirmed that the novel one component epoxy adhesive can cure well at relatively low temperature and its pot life is much longer than conventional two component epoxy adhesives with similar curability and adhesion performance. The novel one component epoxy adhesive was also confirmed to be very stable and its shelf life can be several years long under suitable frozen storage. Based on cure behavior measurement results, cure kinetics of the novel one component epoxy adhesive was investigated. Arrhenius equation obtained from kinetics plot curve was applied to predict pot life and shelf life and it was found that the predicted pot life and shelf life correlate very well with actual measured results. Crystallization temperature of the novel epoxy adhesive was also measured and found to have close relationship with storage stability. This study verified that differential scanning calorimetry isothermal method can be used to predict shelf life of one component epoxy products. In addition, crystallization temperature measurement can be utilized for better stable epoxy adhesive development and suitable storage temperature determination.
Highlights
Epoxy adhesives have been widely used in various applications ranging from general purpose, semiconductor packaging, electronics assembly, automobile production to aerospace industry because of their cured strong chemical structural network and high adhesion to different kinds of substrates [1-5]
We have developed a novel pure liquid one component thermal curable epoxy adhesive that is composed of all liquid reactive components including blend epoxy resins, a liquid type latent curing agent and an accelerator [18]
Curability, workability and stability of a newly developed novel pure liquid one component thermal curable epoxy adhesive were investigated by viscosity and DSC measurement
Summary
Epoxy adhesives have been widely used in various applications ranging from general purpose, semiconductor packaging, electronics assembly, automobile production to aerospace industry because of their cured strong chemical structural network and high adhesion to different kinds of substrates [1-5]. Epoxy adhesives are usually supplied in two components by mixing and packing epoxy resin composition separated from curing agent composition due to high reactivity between epoxy resin and curing agent once mixed together. One component epoxy adhesives which contain all formulated compositions including epoxy resins and curing agents have become more and more important especially for high production efficiency required applications such as semiconductor packaging, electronics assembly and automobile productions [6-9]. Solid type latent curing agent, usually dispersed in epoxy resin as one component material in appearance, has much lower reactivity with epoxy resin at room temperature because of much smaller contact opportunity with epoxy group as compared to liquid type curing
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