Cuprous or cupric? How substrate polarity can select for different phases of copper sulfide films in chemical bath deposition.

Abstract

Copper sulfides have many applications from thermoelectrics to biotechnology. While the properties of different copper sulfide phases are well understood, controlling the deposited copper sulfide stoichiometry remains a significant challenge, especially in solution-phase synthesis techniques. In this work, we investigate the chemical bath deposition of CuxS on functionalized self-assembled monolayers (SAMs). Time-of-flight mass spectrometry, Raman spectroscopy, and x-ray photoelectron spectroscopy are employed to analyze the deposited films. We show that the use of thiourea as a sulfur source leads to the deposition of different copper sulfide phases and is controlled by the interaction of sulfur-containing ions in solution with the functionalized SAMs. For -COOH terminated SAMs, copper sulfide deposition is controlled by the surface polarity of the substrate. At the bath pH used in these experiments, the -COOH terminal groups are deprotonated. The resulting -COO- terminated SAM surface repels negatively charged sulfur-containing ions, leading to the deposition of Cu2S. For -CH3 terminated SAMs, which are non-polar, there is no specific interaction between the SAM terminal group and sulfur-containing ions and CuS is deposited. For -OH terminated SAMs, which have a polar terminal group, there are two competing effects: the repulsion of S-containing ions by the small negative charge of the terminal -OH group and the increase in the concentration of sulfur-containing ions in solution as the bath pH increases. This competition leads to the deposit stoichiometry changing from Cu2S at pH 9 to CuS at pH 12.