Abstract
This article focuses on the effects of Ar+ and beam flow on Cu-W film structure produced using dual ion beam sputtering. The testing method is analysis through XRD. The results show that increasing Ar+ energy and beam flow causes the Cu-W film to crystalize. The Cu-W film deposition speed is primarily determined by Ar+ energy and beam flow.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.