Abstract

Iron based superconducting wires (IBSCs) produced by the Powder in Tube (PIT) method rely on the use of silver sheaths as chemical buffer between the outer metal and the superconducting core. The adoption of silver entails however some limitations, such as the viable temperature range when coupled with copper, and the incompatibility with calcium-based IBSCs already at 600 °C, driving the research towards other wires architecture. Taking inspiration from the low temperature superconductors field, we decided to evaluate the adoption of tantalum as diffusion barrier in a layered Cu/Ta architecture, choosing a Ca/K-1144 IBSC as case study considering the high reactivity issues already reported in the case of silver sheaths for this compound. Squared wires were produced through a groove rolling lamination process coupled with a thermal treatment at 800 °C. The microstructural analyses show the absence of interdiffusion between the different parts of the wire, and the magnetic characterization shows performance in line with similar polycrystalline manufacts, with margin of enhancement to be pursued via the optimization of the mechanical process and other experimental variables. The reported results suggest thus the effectiveness of tantalum as diffusion barrier for Ca/K-1144 PIT wires.

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