Cu-Ni/Cu/Cu-Ni 積層材料の抵抗特性

Abstract

Resistive materials with resistivity (ρ) of 10.3 to 25.1×10-8 Ωm and temperature coefficient of resistance (TCR) of 540 to 2800×10-6 K-1 were successfully fabricated by using the stacking and rolling of metallic sheets of Cu and Cu-Ni. The Cu-Ni/Cu/Cu-Ni sandwich structure showed changes of electrical characteristics with the conditions of heat treatment. The TCR values of the specimens decreased with increase of diffusion layer thickness at the interface of Cu and Cu-Ni layers by heat treatment. This process allows the electrical characteristics to be controlled as required, and the preparation of a precise resistor for current detection.