Cu Ion Plating as a Technique for Enhancing the Mechanical, Electrical and Thermal Bonding Between Cu Stabilizer and the RHQT-Processed<tex>$rm Nb_3rm Al$</tex>Conductors

Abstract

The surface of RHQT-processed Nb/sub 3/Al wires with pure Nb matrix are covered by a strong stable Nb oxide surface layer. In order to obtain good mechanical, electrical and thermal bonding between the Cu stabilizer and RHQT-processed Nb/sub 3/Al wires, it is required to destroy the Nb oxide layer on the surface of the wire. We tried to fabricate a thin Cu layer on the surface of the RHQT-processed Nb/sub 3/Al wires through the Cu ion-plating technique. Before electroplating of thick Cu stabilizers, Cu was ion-plated to a thickness of about 1 /spl mu/m. The Cu ion-plated wire showed no folded projections, cracks, or exfoliation of the Cu stabilizer even when the wire was bent through 180 degrees, showing that Cu and the wire were tightly bonded mechanically. This tight bonding between Cu and the wires should be due to the removal of stable Nb oxide layers from the surface of the wire. The V-I characteristic of wires that were ion-plated and then applied with an appropriate amount of Cu by an electroplating showed no quenching, and the wires were able to carry current up to the normal critical current transition. The measured values of recovery current were almost equivalent to the calculated values, showing that the ion-plated Cu/Nb interface had a very tight bond, allowing good electrical and thermal conductivity. In addition, a reel to reel Cu-ion plating apparatus for the long length wires is demonstrated, and Cu ion plating has been successfully carried out on 100 m long RHQT-processed Nb/sub 3/Al wire at present.