Cu (II) coordination modification of aramid fiber and effect on interfacial adhesion of composites

Abstract

In this article, active groups were introduced to the surface of aramid fiber by building a Cu2+ bridge between the aramid fiber and polyethyleneimine (PEI) to improve adhesion in composites between the aramid fiber and the matrix such as epoxy resin. The changes in the structure and properties of the aramid fiber were verified with Fourier transform infrared (FTIR) spectroscopy, X-ray photoelectron spectroscopy (XPS), scanning electron microscope (SEM), and the single-fiber pull-out test. The FTIR and XPS results show a significant change in the structure and morphology of the aramid fiber after modification. The results of the single-fiber pull-out test show that the interfacial shear strength (IFSS) of epoxy composites reinforced with PEI-grafted aramid fiber increases by 48.8% compared with the IFSS of epoxy composites reinforced with untreated fiber. Thus, the proposed method can improve the interfacial bonding of composites by creating a copper ion bridge between the aramid fiber and PEI.