Cu diffusion along Al grain boundaries

Abstract

Cu grain boundary diffusion (GBD) in Al was investigated by EPMA in temperature range from 300 to 400 °C. The triple product sδD gb ( s—segregation coefficient, δ—grain boundary width, D gb —GBD coefficient) was calculated due to Fisher–Gibbs solution using two methods—measuring of GB concentration in dependence on penetration depth and the contour angle (at the top of diffusion wedge). In the first case s δ D g b = 5.1 · 10 − 11 m 3 s · exp ( − 102 kJ mol R T ) ; in the second s δ D g b = 1.4 · 10 − 11 m 3 s · exp ( − 94 kJ mol R T ) .