Abstract
Thermal dissipation in power electronic devices can be improved through the elaboration of a new generation of layered heat sinks based on copper (Cu) -carbon nanofibers (CNF) composites. Though the high theoretical thermal conductivity of CNF (1200 W/m.K) no Cu-CNF composites with enhanced thermal properties are available. Indeed conventional compositing processes do not allow neither a good dispersion of the nano-reinforcements nor a control of the nanofiber-matrix interface which is not suitable for efficient heat transfers. In this paper, a process based on CNF coating with Cu followed by uniaxial hot pressing in described. It is shown that under proper experimental conditions the salt decomposition coating method is capable of achieving the desired high thermal conductivity values (> 400 W/m.K) thanks to a good dispersion of the CNF, low porosity content and the control of Cu-CNF interfaces.
Highlights
Performance of new power electronic devices is currently limited by packaging of modules
Thermal dissipation in power electronic devices can be improved through the elaboration of a new generation of layered heat sinks based on copper (Cu)-carbon nanofibers (CNF) composites
The goal of this work is to process copper-carbon nanofibers composite materials with enhanced thermal conductivity compared to copper without significantly decreasing thermal expansion values, which will be achieved by the bulk layer made of Cu-carbon fibers (CF) material
Summary
Performance of new power electronic devices is currently limited by packaging of modules. There is a strong need for the development of novel heat dissipation materials They must combine high thermal conductivity and a coefficient of thermal expansion (CTE) compatible with that of the ceramic materials (alumina, silicon nitride or aluminum nitride) on which they are brazed. The CTE of copper can be reproductively reduced (in a plane) to 10 ppm/K by adding carbon fibers (CF) having an axial CTE close to zero. This decrease in heat sink CTE allows a diminution of thermomechanical stresses in power modules and associated phenomena like delamination at solder joints, failure of ceramic that improves the reliability of these modules
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