Abstract
The formation of microduplex structure in a Cu-Ni-Fe alloy has been studied by hardness measurement and optical and electron microscopy observation. The results are summarized as follows:(1) The anneal-softning of the cold rolled specimens is very slow, due to the fact that during the earlier annealing stages, modulated structure is formed prior to recrystallization of supersatulated solid solution and dislocations or cell walls are pinned by finely precipitated NiFe-rich phases.(2) The grain boundary coarsening reaction is accelerated by cold rolling. When the cold reduction rate is more than about 50%, recrystallized Cu-rich grains accompanied by coarsening of NiFe-rich phases preferentially nucleate in the vicinity of the deformation bands and grow as in the case of the grain boundary coarsening reaction. Then, the grain boundary coarsening reaction is suppressed with increasing recrystallized grains.(3) In the heavily deformed specimen, NiFe-rich phases coarsen anywhere including grain boundaries or deformation bands, and recrystallization can start in the area free of the modulation structure around the coarsening NiFe-rich phase. Therefore, the recrystallized structure consists of fine, equiaxed Cu-rich and NiFe-rich grains (microduplex structure).
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