Abstract

Ge waveguides (WGs) were successfully fabricated on an SiO2 layer by combining epitaxial lateral overgrowth, chemical mechanical polishing (CMP), and reactive ion etching (RIE) of a Ge layer selectively grown on SiO2 patterns using low-pressure chemical vapor deposition. Selectivity was promoted by increasing the growth temperature; the length of the epitaxial lateral overgrown Ge layer reached 5 µm on the SiO2 layer under conditions of optimal selective growth at a temperature of 750 °C. The Ge layers were planarized using CMP down to a thickness of 1 µm, and then Ge WGs as active regions for light emitting devices were formed by using RIE on the planarized Ge layers. After defective regions around the Ge/Si interface were removed, 4-times-higher photoluminescence was obtained from the Ge WGs compared with one that contained the Ge/Si interface. These results indicate that this combined technique efficiently improved the performance of Ge light-emitting devices.

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