Abstract

We have examined the formation of 3C SiC thin films on Si substrates by chemical vapor deposition (CVD) method using vinysilane as a single precursor. The epitaxial 3C-SiC film was successfully grown on Si(111) substrate at a lower temperature of 1000 °C. In addition, in-situ phosphorus doping for polycrystalline 3C-SiC was achieved using tri-ethyl-phosphorus as a dopant source. The active dopant concentration as high as 8.2×1019 cm−3 and the resistivity as low as 1.9×10−2 Ωcm was obtained. This resistivity value is comparable to the epitaxial 3C-SiC film formed on Si substrate ever reported at the same dopant concentration region. The fact that resistivity as low as single crystalline films can be obtained at a low temperature of 900°C promises that CVD-grown 3C-SiC films using a single precursor of vinylsilane is a suitable material for a wide range of applications.

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