Abstract
A series of Sb and Sn co-doped anti-perovskite Mn3CuN materials were fabricated by mechanical ball milling followed by solid-state sintering. Their thermal expansion properties and electrical conductivities were investigated in the temperature range of 77-300 K. The results show that Mn3(CuxSb1-x)N (x=0.4, 0.5, 0.6, 0.7) exhibit negative thermal expansion (NTE) below 150 K, and the NTE temperature range shifts toward the lower temperature with the Sb increased. However, Sn doped in the Mn3(Cu0.5SbxSn1-x)N can lead the NTE behavior shifts to room temperature and the NTE operation-temperature window (ΔT) becomes broader. The electrical conductivities of Mn3(Cu0.5SbxSn1-x)N decrease with the temperature and Sb content increased.
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