Abstract
Nanocrystalline copper thin films with as-deposited Σ3 twin boundaries were indented while immersed in liquid nitrogen. Quantification using precession-enhanced electron diffraction determined the crystallographic texture and grain-to-grain misorientation of the undeformed, pile-up and compressed regions. Grains in the undeformed region retained a high density of Σ3 recrystallization twins, whereas the pile-up showed significant coarsening, prevalent Σ7 subgrain formation and a decrease in twin boundaries. The abnormal grain growth is attributed to a detwinning mechanism. The compressed region showed significant grain refinement.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
