Cross-point Resistive Memory

Abstract

Emerging computational resistive memory is promising to overcome the challenges of scalability and energy efficiency that DRAM faces and also break through the memory wall bottleneck. However, cell-level and array-level nonideal properties of resistive memory significantly degrade the reliability, performance, accuracy, and energy efficiency during memory access and analog computation. Cell-level nonidealities include nonlinearity, asymmetry, and variability. Array-level nonidealities include interconnect resistance, parasitic capacitance, and sneak current. This review summarizes practical solutions that can mitigate the impact of nonideal device and circuit properties of resistive memory. First, we introduce several typical resistive memory devices with focus on their switching modes and characteristics. Second, we review resistive memory cells and memory array structures, including 1T1R, 1R, 1S1R, 1TnR, and CMOL. We also overview three-dimensional (3D) cross-point arrays and their structural properties. Third, we analyze the impact of nonideal device and circuit properties during memory access and analog arithmetic operations with focus on dot-product and matrix-vector multiplication. Fourth, we discuss the methods that can mitigate these nonideal properties by static parameter and dynamic runtime co-optimization from the viewpoint of device and circuit interaction. Here, dynamic runtime operation schemes include line connection, voltage bias, logical-to-physical mapping, read reference setting, and switching mode reconfiguration. Then, we highlight challenges on multilevel cell cross-point arrays and 3D cross-point arrays during these operations. Finally, we investigate design considerations of memory array peripheral circuits. We also portray an unified reconfigurable computational memory architecture.