Crosslinking of porous SiOCH films involving Si–O–C bonds: Impact of deposition and curing

Abstract

This paper focuses on the properties of nanoporous SiOCH thin films deposited using a porogen approach by plasma enhanced chemical vapor deposition. The impact of deposition temperature, porogen loading and porogen removal treatment is investigated using Fourier transform infrared spectroscopy, solid-state nuclear magnetic resonance analysis, and electrical and mechanical measurements. This work shows that a higher deposition temperature allows limiting the film shrinkage during the porogen removal treatment and leads to the best compromise in term of electrical and mechanical properties. Beside, the effect of Si–O–C bonds on the enhancement of mechanical properties is promoted since a typical crosslinking mechanism is highlighted in case of ultraviolet curing.