Critical conditions and grain growth model for dynamic recrystallization of Cu-Ni-Si alloy

Abstract

Hot compression tests of Cu-Ni-Si alloy with high Ni and Si contents were performed at the deformation temperatures of 750–950 °C, and the strain rates of 0.01–10 s−1 on a Gleeble-3800 thermo-mechanical simulator. The critical conditions for dynamic recrystallization (DRX) of Cu-Ni-Si alloy were obtained by processing the collected data and combining with the inflection point of θ-σ curve with the minimum value criterion of −∂θ/∂σ-σ curve. There was a certain correlation between the critical strain (εc) and the peak strain (εp), that was, εc/εp = 0.723, and the functional relationship between εc and Z parameter was εc = 1.05 × 10−3Z0.059. The average recrystallized grain size under various deformation conditions was measured, and the DRX grain growth model of Cu-Ni-Si alloy was established as dDRX = 5650.4ε̇−0.12891exp(−73142/RT).