Abstract
Creep rupture lifetimes of Cu particle enhancement SnPb based composite solder joints and the matrix solder joints are tested under different temperatures and stresses and the creep rupture mechanism is analyzed.Results show that the creep resistance of the composite solder joints is superior to that of the matrix solder joints.It is the main reason that the Cu_6Sn_5 intermetallic compound layer formed between the matrix and the counteract of Cu particles to creep behavior make for the high creep resistance of the composite solder.A thin Pb-rich phase which lies on the cooper substrate of solder joints cause directly the creep rupture of the solder joints.
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