Abstract
This chapter presents a study of the creep behavior of a printed wiring board (PWB) caused by the mechanical fastening of separable connector, known as the land grid array (LGA). The time-temperature superposition (TTSP) method was employed to predict the lifetime creep behavior. A low-cost testing method based on the ASTM D790 three-point bending procedure was developed to predict and characterize creep of polymeric materials under low temperature, low stress, and large elapsed times.
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