Abstract
The creep behavior of a laminate system consisting of alternate layers of pure aluminum and SAP (sintered aluminum powder) sheet has been examined in the temperature range 323 to 473 K and in the stress range 35 to 68 MN m−2. It was observed that secondary creep strain in the laminates was greater than in elemental SAP; the secondary creep strain rate in laminates was lower than that in pure aluminum and the creep rate decreased with increasing fracture of SAP. A stress exponent (n) value of ∼20 was observed for most of the laminates and was reasonably constant for 3, 5, 7, and 9 ply laminates and volume fractionsV f ) in the range 0.3 <V f < 0.65. For higher volume fractions of SAP the mechanical behavior of the laminates was similar to that of SAP. The experimental activation energy for creep of 30.5 ± 5 Kcal mol−1 correlates well with that for self-diffusion in aluminum. Laminating induced appreciable ductility to the SAP.
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