Abstract
Abstract The long-term creep behaviour of OFHC copper was investigated at 4.2 K and 77 K. At 77 K, steady-state creep was observed and the creep rates were tens of orders of magnitude higher than would be expected from extrapolations of ambient temperature creep data. The stress exponent obtained at 77 K is 2.2. The apparent activation energy at 77–90 K range is about 0.02 eV. At 4.2 K, transient creep was observed. TEM study of all crept specimens showed cell structures in support of the occurrence of substantial creep at cryogenic temperatures.
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