Abstract
The behavior and micromechanism of creep crack growth (CCG) of GH3535 alloy at 650 to 750 °C have been investigated experimentally. The relationships among the effective stress intensity factor, fracture parameter C ⁎ , and CCG rate were obtained and the effect of temperature on the crack initiation time were analyzed. The results show that it is suitable to use the fracture parameter C ⁎ to correlate the CCG rate at different temperatures and that the CCG rate and fracture parameter C ⁎ have a good linear relationship in a narrow band in the log-log scale. This linear relationship does not depend on temperature when using the fracture parameter C ⁎ to correlate the crack initiation time. During crack propagation, intergranular propagation and dimple transgranular fracture occurred successively. The crack growth is found to be accompanied by oxidation. • Creep crack growth behavior of GH3535 allov used as structural material of TMSR at different temperatures was investigated. • The relationships between crack gowth rate crack initiation time and C* parameter are independent of temperature. • The propagation mechanism of GH3535 at different temperatures was found by observing the fracture and crack tip morphology. • Oxidation promotes the crack growth and the interaction between crack growth and oxidation is described.
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