Creep Behavior of Nickel-Copper Solid Solution Alloys below 0. 55 Tm

Abstract

In two recent creep studies of inhomogeneous nickelcopper solid solution alloys,i.e. cast weld metal with solidification-induced composition gradients[1] and nickelcopper laminate composites with controlled composition gradients across the layers,[2] the creep rates at an intermediate temperature (500 °C) were shown to decrease with an increase in homogenization. The creep behavior in inhomogeneous alloy systems reflects the composite effects of position-dependent creep properties as controlled by solid solution alloy content. To utilize composite modeling techniques in creep analyses of materials with composition gradients, creep data of homogeneous materials as a function of alloy content are required. Therefore, this study was undertaken to evaluate the creep behavior of nickel-copper solid solution alloys at intermediate temperatures and to provide a base set of data to evaluate the effect of gradients described above.[1,2]