Abstract
The creep behavior of hot-pressed silicon nitride (HPSN) ceramics with rare-earth oxides and alumina additives has been studied. The creep experiments were performed under bending stress of 200–360 MPa and at temperatures of 1170–1360°C in air. The creep resistance of HPSN with rare-earth additives only is much higher than that with rare-earth oxides plus alumina. With increasing alumina content, the creep rate increases rapidly and the creep activation energy decreases. Based on the stress exponent and microstructural observations, a “mixed” mechanism of creep including both diffusion and grain-boundary sliding is suggested for HPSN with rare-earth oxides only. The creep mechanism of HPSN with rare-earth oxides and alumina is described to grain-boundary sliding accommodated by void formation.
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