Abstract
In this paper, extensive testing was conducted to study the effects of Lanthanum (La) doping on the creep and fatigue behavior of SnAg lead free solder alloys. Variables considered in this paper include doping amount, aging temperature, and aging time. The experimental data show that rare earth element (RE) doping increases SnAg solders creep resistance by about 15%. Meanwhile, RE doping does not affect thermal aging behavior of the solder alloy. A microstructure dependent Anand viscoplastic model is proposed to capture the RE doping effect on the creep behavior. Good agreement between the model predictions and experimental data are obtained. In addition, fatigue tests were performed with bulk specimen. It is found that La doping increases the fatigue life by about five times. The optimal doping level for better fatigue performance is around 0.1%.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Components and Packaging Technologies
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
