Abstract
Industrial interest in thermal management is rapidly increasing due to the increase in the amount of heat generated by semiconductor devices as their performance improves in terms of miniaturization, higher power output, and higher density. Radiation of heat from a material surface is a phenomenon of electromagnetic wave emission, and the wavelength of the emitted electromagnetic wave varies with temperature according to Planck's law. In this paper, we aim to create functional heat radiation surfaces that can enhance heat dissipation performance in a specific temperature range by controlling the wavelength range of electromagnetic waves emitted from the material surface. Micro-cutting and ultrashort pulsed laser machining were used to fabricate various microstructures and their effects on heat radiation were investigated. It was found that the combination of a groove structure with an electromagnetic wavelength size and a sub-micrometer size groove structure can provide a temperature selectivity that increases the radiation flow in a specific temperature range.
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