Crack suppression of silica glass formed by zoned F2 laser-induced photochemical surface modification of hard silicone thin film coating on polycarbonate

Abstract

The surface layer of a hard silicone thin film coating on polycarbonate was modified to silica glass (SiO2) through F2-laser-induced photochemical reactions. To obtain samples with higher abrasion resistances, SiO2 films of 1 µm thickness and over were successfully formed without cracking, by zoning the laser-irradiated area of micrometer order. With the conversion of silicone to SiO2, the volumetric shrinkage of the sample was induced, which simply depended on the number of photons, by varying the single-pulse fluence and irradiation time of a F2 laser. The ratio of volumetric shrinkage to the original silicone was estimated to be approximately 0.85, generating tensile stress in SiO2. The stress could be suppressed to be lower than 48 MPa for typical SiO2 by reducing the laser-irradiated area to be of micrometer order. Also, when the length of one side of the irradiated area is 1 mm, the thickness of the SiO2 film is expected to increase to approximately 5 µm.