Abstract
Crack deflection angles and fracture modes were investigated by elaborative observation of 5764 crack deflections, generated at 77K, 159K, 293K and 500K, in silicon nitride (Si3N4) ceramics. In addition, the effects of grain boundary toughness on crack propagation in Si3N4 ceramics were statistically analyzed based on a two-dimensional, polycrystalline model. The results demonstrated that temperature (77–500K) had little influence on crack advance, but the change of grain boundary toughness contributed a lot to the change of crack propagation. The distribution of deflection angles varied distinctly and the fraction of transgranular fracture increased when the grain boundary toughness increased.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
