Abstract
We first investigate the configurational stability of a semi-infinite crack in the substrate of an isotropic, linearly elastic film/substrate system under residual tension in the thin film. The crack runs parallel to the film/substrate interface. The propagation is found to be generally unstable. We further consider the interaction of the crack, under the same loading, either with a crack in the thin film perpendicular to the interface, or with a finite length interface crack. We calculate the stress intensity factors for both cracks, as well as the non-singular T stress for the substrate crack. The path of the substrate crack under the attraction of film cracking or interface debonding is qualitatively studied based on Cotterell-Rice theory. While the interface debonding does not have a great effect on the probable path of the substrate crack, the presence of a perpendicular crack in the thin film leads to three possible paths for the substrate crack. These are discussed.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.