Abstract

AbstractCracking during sintering is a common problem in powder processing and is usually caused by constraint that prevents the sintering material from shrinking in one or more directions. Different factors influence sintering‐induced cracking, including temperature schedule, packing density, and specimen geometry. Here we use the discrete element method to directly observe the stress distribution and sinter‐cracking behavior in edge notched panels sintered under a uniaxial restraint. This geometry allows an easy comparison with traditional fracture mechanics parameters, facilitating analysis of sinter‐cracking behavior. We find that cracking caused by self‐stress during sintering resembles the growth of creep cracks in fully dense materials. By deriving the constrained densification rate from the appropriate constitutive equations, we discover that linear shrinkage transverse to the loading axis is accelerated by a contribution from the effective Poisson's ratio of a sintering solid. Simulation of different notch geometries and initial relative densities reveals conditions that favor densification and minimize crack growth, alluding to design methods for avoiding cracking in actual sintering processes. We combine the far‐field stress and crack length to compute the net section stress, finding that it characterizes the stress profile between the notches and correlates with the sinter‐crack growth rate, demonstrating its potential to quantitatively describe sinter‐cracking.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.