Abstract
The effects of cyclic loading conditions (either thermal or mechanical) on the reliability of electronic assemblies are strongly dependent on the performance of solder joints. Most solder joint fatigue models, and the supporting experimental data, do not treat the crack propagation processes that lead to failure. The benefits from a physically based description of crack propagation in solder joints include an accurate representation of the damage produced by cyclic loading and, therefore, a superior basis to evaluate attachment designs and materials. The development of crack growth rate models has been hampered by the lack of experimental capabilities to observe and characterize crack propagation in solder joints and a computational capability to describe the propagation of cracks in solder joints. This paper describes several approaches that have been used to measure crack propagation rates in solders and a new approach to quantify the crack growth rate and its driving force in solder joints by a quantitative analysis of the fracture surface topography.
Published Version
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