Abstract
It is difficult to eliminate recast layers and cracks in laser-machining caramics. These defects significantly detract from the excellent properties of ceramics. This paper describes the feasibility of a crack-free processing method for hot-pressed silicon nitride (Si3N4) ceramics using a yttrium aluminum garnet (YAG) laser. The Q-switched YAG laser pulses controlled at below 500 ns in duration and 10 kHz in repetition rate are effective for the purpose of crack-free machining of Si3N4 ceramics because the thermal stress is most likely localized only in the laser-heated shallow area. The integrity of the crack-free surface is evaluated by the fracture strength and residual stress. The strength of laser-processed test pieces is reduced by 10 to 20% compared with diamond-ground ones because the high residual compression layer generated during grinding is removed.
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Schedule a callMore From: JSME international journal. Ser. 3, Vibration, control engineering, engineering for industry
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