Abstract
In this paper, we present the design of an effective pulse current deposition process for low stress, crack-free Cr coatings deposited from standard Cr3+ electrolyte commonly used by industry. Parameters for pulse current deposition process such as and duty cycle are based on detailed analysis and modeling of in situ stress transients during Cr deposition and relaxation. A general procedure and criterion are derived for pulse current function design which should be of broader significance for the synthesis of functional Cr coatings. Comparative characterization of pulse and direct current deposited Cr films is presented. These data illustrate superior properties and stress-state of the Cr films deposited using our newly developed approach to pulse current function design.
Highlights
We present the design of an effective pulse current deposition process for low stress, crack-free Cr coatings from standard Cr3+ electrolyte commonly used by industry
We expect that Cr(OH)[3] incorporation into the Cr deposit is the main source of O we see in our EDS data
We re-state again that the lower content of Crhydride in pulse current (PC) deposited films leads to their lower propensity for cracking during the aging process. This phenomenon is the most likely reason for their improved hardness and higher apparent metallicity as compared to direct current (DC) deposited films. This is the first report of the PC deposition process that is based on the modeling and analysis of the in situ stress transients during thin film deposition and relaxation
Summary
The electrodeposited thin films and coatings are commonly used today in all fields of technology enterprise Their properties are largely a function of electrodeposition parameters (direct current, pulse current, pulse potential, etc.)[1] and solution design (additive content, anions, complexing agents, etc.).[2,3,4] A good example is chromium coatings. Their superb mechanical and corrosion properties have led to many applications and the spread of industrial chromium plating technology across the world. The average stress in the deposit was obtained by dividing the measured (F /W ) values with the appropriate thickness of the deposit determined from measured deposition rate (Ƒ) and deposition time (tD).[18,20]
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