Abstract
A study of the behavior of a transverse crack propagating at right angles through the interface of a bimaterial plate was undertaken by means of the method of high-speed photography along with the optical method of transmitted caustics. The investigation was mainly concentrated on the changes of the stress intensity factor at the tip of a moving crack when reaching the bimaterial interface. The investigation was also extended to duplex plates consisting of the same material in both phases of the duplex.The results have shown that the process of crack arrest at the interfaces of duplex specimens depends mainly on the material discontinuity that this interface region presents on the process of crack propagation and not on the abrupt change of the mechanical properties of the materials of the phases.Therefore, the dynamic problem of a crack reaching an interface can in no way be appropriately approached by means of only the results of the static analysis.By studying the dynamic process of crack arrest at an interface we have formulated a rule for the experimental determination of the stress intensity factor during the whole process of crack arrest.Finally and in relation with the above experimental evidence, the dependence between crack propagation and stress wave emission from the tip of a moving crack was also discussed.
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