Cr 3+ microspectroscopy measurements and modelling of local variations in surface grinding stresses in polycrystalline alumina

Abstract

Surface residual stresses caused by grinding and polishing of alumina are thought to influence materials properties but have previously been measured only by low spatial resolution techniques which sample average stresses. In this work confocal Cr 3+ fluorescence microscopy has been used to investigate the spatial distribution of the residual stresses. A model for the residual stresses, accounting for both surface plastic deformation and “pullout” of material from the surface by brittle fracture, was developed to help in analysing the results. After coarse diamond grinding, the results showed that the residual stresses fluctuate greatly with position. Large tensile stresses (up to ∼600 MPa) were found below the plastically deformed surface layer in regions between the “pullouts”. These tensile stresses are expected to aid crack propagation and further surface pullout. They arise because pullout removes parts of the plastically deformed surface layer. The stresses beneath the pullout sites themselves were compressive, but the largest compressive stresses (≈−1.5 GPa) were within the plastically deformed surface regions and extended to a depth of 1.3 μm. The plastically deformed surface layer was much shallower following polishing with 3 μm diamond paste but the compressive stress within it was of similar magnitude to that in the plastically deformed surface layer caused by grinding.