Abstract

The disulfide‐based poly(ether‐b‐amide) copolymer with polyamide hard segment and polyether soft segment is a new developed material that can be easily repaired under moderate conditions. The amorphous aggregated structure facilitates the diffusion of segments as well as the recombination of disulfide bonds and H‐bonds. Due to the excellent low‐temperature flexibility, rapid self‐healing capability and convenient recyclability, the material shows great potential application in the fields of low‐temperature packaging, sealing and solid propellants. More details are discussed in the article by Dong et al. on page 943—950. image

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