Abstract
This cover designed by Xuemei Li and Peng Zhao demonstrates the metallic contamination control of the fittings transporting ultrapure water in immersion lithography. The influence of process parameters on metallic contamination is investigated and optimized through the orthogonal experiment. This paper provides a novel idea for improving the cleanliness of the environment in chip manufacturing and a contribution to the next generation of chips. DOI: 10.1002/app.53940
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