Abstract
In this paper, the design and analysis of an ultracompact coupler based on a hybrid silicon plasmonic waveguide (HSPW) is proposed and its coupling and crosstalk characteristics have been theoretically investigated for the development of optical interconnects that can be realized using well-established complementary metal-oxide-semiconductor-compatible fabrication techniques. To determine the minimum horizontal separation distance and efficient coupling length for the designed coupler, the symmetric and antisymmetric supermodes are obtained and their characteristics are studied at a wavelength of 1.55 μm. Efficient light coupling is exhibited by the HSPW coupler with 75 % of power transfer between the two HSPWs with ultrashort coupling length of 2.14 μm when the separation distance is 50 nm. Further, it is shown that the crosstalk is significantly reduced with the insertion of metallic strip between the two HSPWs for realizing highly dense integrated plasmonic circuits.
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