Abstract
In this paper, we address theoretically and experimentally the optimization problem of the heat transfer occurring in two coupled thermoelectric devices. A simple experimental set up is used. The optimization parameters are the applied electric currents. When one thermoelectric is analysed, the temperature difference Δ T between the thermoelectric boundaries shows a parabolic profile with respect to the applied electric current. This behaviour agrees qualitatively with the corresponding experimental measurement. The global entropy generation shows a monotonous increase with the electric current. In the case of two coupled thermoelectric devices, elliptic isocontours for Δ T are obtained in applying an electric current through each of the thermoelectrics. The isocontours also fit well with measurements. Optimal figure of merit is found for a specific set of values of the applied electric currents. The entropy generation-thermal figure of merit relationship is studied. It is shown that, given a value of the thermal figure of merit, the device can be operated in a state of minimum entropy production.
Highlights
As the size of electronic devices decreases with further miniaturization techniques, there has been the problem of a large heat generation in small areas
∆T ≈ 25 K, whereas Figure 3b presents elliptic isovalues of ∆T as function of the two electric currents, when the system is composed on two thermoelectric devices
The single and two thermoelectric system, the electric current is normalized with I0 = 0.93 A, which is the optimal current for a single device
Summary
As the size of electronic devices decreases with further miniaturization techniques, there has been the problem of a large heat generation in small areas. Thermoelectric coolers are an alternative to efficiently dissipate heat generated in such conditions. Optimal performance is obtained when the entropy generation is a low minimum under the operating constrictions. We study the thermal performance of a two-stage cooler with a dual purpose: (1) to theoretically model the transport of heat in the device and qualitatively compare theoretical predictions with experimental measurements of the temperature difference achieved between the hot and the cold faces in different operating conditions; and (2) to determine the relationship between global entropy production in the cooler and thermal performance measured by the thermal figure of merit [1]. The theoretical models used to describe transport phenomena in thermal devices are based on global energy balances at the ends and interfaces of the devices. We use a local steady-state model that allows us to describe the spatial distribution
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